Invention Application
- Patent Title: CIRCUIT BOARD
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Application No.: US18723616Application Date: 2022-12-23
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Publication No.: US20240407103A1Publication Date: 2024-12-05
- Inventor: Chae Young YOU , Soo Min LEE , Jae Hun JEONG
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Priority: KR10-2021-0186539 20211223
- International Application: PCT/KR2022/021233 WO 20221223
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L23/00 ; H01L23/13 ; H05K1/11

Abstract:
A circuit board according to an embodiment includes a first insulating layer; and a second insulating layer disposed on the first insulating layer and including a cavity; wherein the second insulating layer includes a lower surface of the cavity positioned higher than an upper surface of the first insulating layer, wherein the lower surface of the cavity includes: a plurality of first portions, and a plurality of second portions provided between the plurality of first portions and having a height different from that of the plurality of first portions, and wherein a height difference between a portion having a highest height and a portion having a lowest height of the plurality of first portions is 1 μm or less.
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