Invention Application
- Patent Title: HOT MELT ADHESIVE COMPOSITION AND ADHESIVE TAPE USING SAID HOT MELT ADHESIVE COMPOSITION
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Application No.: US18691482Application Date: 2022-09-28
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Publication No.: US20240409780A1Publication Date: 2024-12-12
- Inventor: Sho UCHIDA , Kohei TAKEDA , Shinsuke IKISHIMA
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP2021-158889 20210929
- International Application: PCT/JP2022/036201 WO 20220928
- Main IPC: C09J7/35
- IPC: C09J7/35 ; C09J7/10 ; C09J11/08

Abstract:
Provided are a pressure-sensitive adhesive composition that has a sufficient initial pressure-sensitive adhesive strength and can achieve both a resealing property and an easy unsealing property, and a pressure-sensitive adhesive tape using the pressure-sensitive adhesive composition. A hot-melt pressure-sensitive adhesive composition according to an embodiment of the present invention includes a styrene-based elastomer, an olefin-based elastomer, and a tackifier. The hot-melt pressure-sensitive adhesive composition includes 2 wt % to 80 wt % of the styrene-based elastomer, 2 wt % to 50 wt % of the olefin-based elastomer, and 2 wt % to 40 wt % of the tackifier.
Information query
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