Invention Grant
- Patent Title: Ohmic contacts to silicon bodies
- Patent Title (中): 欧姆接触硅体
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Application No.: US47202654Application Date: 1954-11-30
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Publication No.: US2874341APublication Date: 1959-02-17
- Inventor: BIONDI FRANK J , CLEVELAND HUGH M , SULLIVAN MILES V
- Applicant: BELL TELEPHONE LABOR INC
- Assignee: Nokia Bell Labs
- Current Assignee: Nokia Bell Labs
- Priority: US47202654 1954-11-30
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/06
Information query
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