Invention Grant
- Patent Title: Slide clamp
- Patent Title (中): 滑动夹
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Application No.: US14316461Application Date: 1961-10-05
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Publication No.: US3132390APublication Date: 1964-05-12
- Inventor: BODEN OGDEN W
- Applicant: BODEN OGDEN W
- Assignee: Ogden W Boden
- Current Assignee: Ogden W Boden
- Priority: US14316461 1961-10-05
- Main IPC: A41F1/00
- IPC: A41F1/00 ; F16G11/04 ; F16G11/14
Public/Granted literature
- US09305809B1 Integrated circuit packaging system with coreless substrate and method of manufacture thereof Public/Granted day:2016-04-05
Information query
