Process of placing a copper layer on an aluminum electrical connector

Invention Grant

US3148086A Process of placing a copper layer on an aluminum electrical connector 失效

Title translation: 在铝电连接器上放置铜层的工艺

Patent Title: Process of placing a copper layer on an aluminum electrical connector
Patent Title (中): 在铝电连接器上放置铜层的工艺
Application No.: US14377461

Application Date: 1961-10-09
Publication No.: US3148086A

Publication Date: 1964-09-08
Inventor: SEIBERT PHILIP M H
Applicant: SEIBERT PHILIP M H
Assignee: Philip M H Seibert
Current Assignee: Philip M H Seibert
Priority: US14377461 1961-10-09
Main IPC: H01B1/02
IPC: H01B1/02 ; H01H1/02

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IPC分类:

H	电学
H01	基本电气元件
H01B	电缆；导体；绝缘体；导电、绝缘或介电材料的选择（磁性材料的选择入H01F1/00；波导管入H01P）
H01B1/00	按导电材料特性区分的导体或导电物体；用作导体的材料选择（按材料特性区分的超导或高导导体、电缆或传输线入H01B12／00）
H01B1/02	.主要由金属或合金组成的