A planar receptacle for pluggable mounting of electronic component leads therein which is formed by applying a resilient, electrically conductive material over an apertured base, and forming a pattern of planar cuts in said resilient layer over each aperture in the base such that when an electronic component lead is pressed onto the resilient layer over an aperture, the resilient layer will deform into the aperture to form at least one contact apron capable of supporting said electronic component lead and capable of making electrical contact with said lead.