Invention Grant
- Patent Title: Printed wiring board assembly
- Patent Title (中): 印刷线路板组件
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Application No.: US37979073Application Date: 1973-07-16
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Publication No.: US3819989APublication Date: 1974-06-25
- Inventor: BRAUNE D
- Applicant: BELL TELEPHONE LABOR INC
- Assignee: Nokia Bell Labs
- Current Assignee: Nokia Bell Labs
- Priority: US37979073 1973-07-16
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/11 ; H05K1/18 ; H05K3/00 ; H05K1/04
Abstract:
A printed wiring multiple circuit board assembly fabricated from a single blank, flexible tape carrying a plurality of conductors extending to circuitry carried by the circuit boards. The boards are arranged at right angles to a main tape at the end of tape tabs carrying branching conductors to a board circuitry. The tape tabs are folded and refolded so that the boards come to rest in mutually parallel planes perpendicular to the main tape.
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