Invention Grant
US4383003A Transfer lamination of copper thin sheets and films, method and product
失效
铜薄片和薄膜的转移层压，方法和产品
- Patent Title: Transfer lamination of copper thin sheets and films, method and product
- Patent Title (中): 铜薄片和薄膜的转移层压，方法和产品
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Application No.: US189003Application Date: 1980-09-22
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Publication No.: US4383003APublication Date: 1983-05-10
- Inventor: Eric Lifshin , Joseph D. Cargioli , Stephen J. Schroder , Joe Wong
- Applicant: Eric Lifshin , Joseph D. Cargioli , Stephen J. Schroder , Joe Wong
- Applicant Address: NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: NY Schenectady
- Main IPC: C23C14/06
- IPC: C23C14/06 ; B32B15/08 ; C23C14/00 ; H05K3/02 ; H05K3/38 ; B32B15/20
Abstract:
A copper-clad laminate having special utility in the production of high resolution printed circuit patterns by either subtractive or semi-additive processing is made by vapor depositing a film of zinc on a copper film on a silica-coated aluminum carrier sheet, vapor depositing a silica film on the resulting zinc-copper foil, bonding the resulting body to a substrate and then stripping the silica-coated aluminum carrier sheet from the copper-clad laminate.
Public/Granted literature
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