Invention Grant
- Patent Title: High density connector system
- Patent Title (中): 高密度连接器系统
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Application No.: US863643Application Date: 1992-04-03
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Publication No.: US5205738APublication Date: 1993-04-27
- Inventor: Herbert R. Anderson, Jr. , Arthur Bross , Julian G. Cempa , Robert O. Lussow , Donald E. Myers , Thomas J. Walsh
- Applicant: Herbert R. Anderson, Jr. , Arthur Bross , Julian G. Cempa , Robert O. Lussow , Donald E. Myers , Thomas J. Walsh
- Applicant Address: NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: NY Armonk
- Main IPC: H01R4/02
- IPC: H01R4/02 ; H01R12/52 ; H01R43/02 ; H01R43/16 ; H05K3/40
Abstract:
There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system.
Public/Granted literature
- US5931658A Fuel cell power plant furnace Public/Granted day:1999-08-03
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