Invention Grant
- Patent Title: Resin composition
- Patent Title (中): 树脂组成
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Application No.: US350692Application Date: 1994-12-07
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Publication No.: US5539077APublication Date: 1996-07-23
- Inventor: William C. Floyd
- Applicant: William C. Floyd
- Applicant Address: SC Chester
- Assignee: Sequa Chemicals, Inc.
- Current Assignee: Sequa Chemicals, Inc.
- Current Assignee Address: SC Chester
- Main IPC: C08G12/00
- IPC: C08G12/00 ; C08G12/12
Abstract:
A resin composition useful as a binder is provided comprising the reaction product of an amine derivative chosen from melamine, glycolurile or their mixtures with a C.sub.1 to C.sub.8 dialkoxyethanal, the reaction product is then mixed with a polyol.
Public/Granted literature
- US6138891A Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits Public/Granted day:2000-10-31
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