Invention Grant
- Patent Title: Wiring board for high-frequency signals and semiconductor module for high-frequency signals using the wiring board
- Patent Title (中): 使用接线板的高频信号接线板和高频信号半导体模块
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Application No.: US725167Application Date: 1996-10-03
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Publication No.: US5764119APublication Date: 1998-06-09
- Inventor: Takeshi Miyagi , Yuji Iseki , Yasushi Shizuki , Kunio Yoshihara , Masayuki Saito , Kazuhito Higuchi , Takeshi Hanawa , Eiji Takagi
- Applicant: Takeshi Miyagi , Yuji Iseki , Yasushi Shizuki , Kunio Yoshihara , Masayuki Saito , Kazuhito Higuchi , Takeshi Hanawa , Eiji Takagi
- Applicant Address: JPX Kawasaki
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JPX Kawasaki
- Priority: JPX7-267014 19951016; JPX8-120477 19960515; JPX8-240527 19960911
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H05K1/02 ; H05K1/14 ; H05K3/04 ; H05K3/10 ; H05K3/46
Abstract:
A wiring board for high-frequency signals, which comprises, a substrate, a dielectric layer formed on the substrate and provided on its surface with a U-shaped groove having an arcuate bottom for forming a wiring therein, and a signal wiring formed in the U-shaped groove, which is featured in that an upper end portion of the signal wiring is protruded out of the surface of the dielectric layer. A distance (H) from a protruded top surface of the signal wiring to a bottom of the U-shaped groove and a width (W) of the U-shaped groove preferably meet a relationship of 2
Public/Granted literature
- US4683087A Anti-cancer agents and processes for their preparation Public/Granted day:1987-07-28
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