Invention Grant
- Patent Title: Method and apparatus for baking out a gate valve in a semiconductor processing system
- Patent Title (中): 在半导体处理系统中烘烤闸阀的方法和装置
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Application No.: US635094Application Date: 1996-04-17
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Publication No.: US5965046APublication Date: 1999-10-12
- Inventor: Timothy Joseph Franklin , David Datong Huo
- Applicant: Timothy Joseph Franklin , David Datong Huo
- Applicant Address: CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: CA Santa Clara
- Main IPC: F16K3/00
- IPC: F16K3/00 ; F04B37/08 ; F04B37/16 ; F16K49/00 ; F16K51/02 ; H01L21/203
Abstract:
A device for achieving vacuum conditions more quickly in a semiconductor processing system having a vacuum pump, a gate valve and a chamber includes a rigid body containing heating elements that contact the surface of the gate valve. The device may include a U-shaped retainer clip for holding the device to the gate valve. A method for heating a gate valve to drive off contaminants involves heating the lower portion of the gate valve to drive contaminants towards the vacuum pump.
Public/Granted literature
- US5224039A Method of enabling the translation of machine readable information Public/Granted day:1993-06-29
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