Invention Grant
- Patent Title: Polyphenylene oligomers and polymers
- Patent Title (中): 聚亚苯基低聚物和聚合物
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Application No.: US834677Application Date: 1997-04-01
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Publication No.: US5965679APublication Date: 1999-10-12
- Inventor: James P. Godschalx , Duane R. Romer , Ying Hung So , Zenon Lysenko , Michael E. Mills , Gary R. Buske , Paul H. Townsend, III , Dennis W. Smith, Jr. , Steven J. Martin , Robert A. DeVries
- Applicant: James P. Godschalx , Duane R. Romer , Ying Hung So , Zenon Lysenko , Michael E. Mills , Gary R. Buske , Paul H. Townsend, III , Dennis W. Smith, Jr. , Steven J. Martin , Robert A. DeVries
- Applicant Address: MI Midland
- Assignee: The Dow Chemical Company
- Current Assignee: The Dow Chemical Company
- Current Assignee Address: MI Midland
- Main IPC: C08G61/10
- IPC: C08G61/10 ; C08F38/00
Abstract:
An oligomer, uncured polymer or cured polymer comprising the reaction product of one or more polyfunctional compounds containing two or more cyclopentadienone groups and at least one polyfunctional compound containing two or more aromatic acetylene groups wherein at least some of the polyfunctional compounds contain three or more reactive groups. Such oligomers and uncured polymers may be cured to form cured polymers which are useful as dielectrics in the microelectronics industry, especially for dielectrics in integrated circuits.
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