Surface mount test and/or burn-in sockets for electronic device packages are formed using contact pins supported between the top of a circuit board and the lower surface of the terminal lead. The central portion of each contact pin is secured in the socket base so that one end of the pin extends into a cavity in the socket and the other end extends from the lower surface of the socket. The ends of the contact pins are supported on curved beams which are designed to control the pressure exerted on the terminal leads and on the contact pads independently.