Invention Grant
- Patent Title: Laser soldering procedure applicable to the joining of pins over printed circuit boards
- Patent Title (中): 激光焊接程序适用于印刷电路板上的引脚连接
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Application No.: US267284Application Date: 1999-03-12
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Publication No.: US6160239APublication Date: 2000-12-12
- Inventor: Jose Antonio Cubero Pitel
- Applicant: Jose Antonio Cubero Pitel
- Priority: ESX9800549 19980313
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K1/005 ; B23K26/12 ; B23K26/20 ; B23K101/42 ; H05K3/00 ; H05K3/32 ; H05K3/34 ; H05K3/40
Abstract:
The proposed procedure, that of laser soldering or welding, is an auto-energetic process in which the density of the laser beam is obtained because of the concentration of light beams. Said process involves two metals (alike or disimilar) and, previously to the metallurgical union, same must be positioned in front of the laser head with enough accuracy. The metallurgical union is carried out by direct fusion of the metals to be joined and not being therefore necessary to use any filler metal.
Public/Granted literature
- US4923893A External preparation of vitamin-E Public/Granted day:1990-05-08
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