Invention Grant
- Patent Title: Flexible interconnection between integrated circuit chip and substrate or printed circuit board
- Patent Title (中): 集成电路芯片与基板或印刷电路板之间的灵活互连
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Application No.: US09215802Application Date: 1998-12-18
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Publication No.: US06188582B1Publication Date: 2001-02-13
- Inventor: Geoffrey Peter
- Applicant: Geoffrey Peter
- Main IPC: H05K118
- IPC: H05K118
Abstract:
A flexible integrated circuit mounting apparatus and method for mounting a chip on a printed circuit board directed to the reduction of stresses within the mounting or interconnection medium, caused principally by a mismatch of the coefficient of thermal expansion between the chip circuit and the printed circuit board, and thus reduction of the likelihood of interconnection failure between the chip and the particular surface or device to which an interconnection is made.
Information query
