Method of making conductive bump on wiring board

Invention Grant

US06351885B2 Method of making conductive bump on wiring board 失效

Title translation: 在接线板上制作导电凸块的方法

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Patent Title: Method of making conductive bump on wiring board
Patent Title (中): 在接线板上制作导电凸块的方法
Application No.: US09079857

Application Date: 1998-05-15
Publication No.: US06351885B2

Publication Date: 2002-03-05
Inventor: Etsuji Suzuki , Akira Yonezawa , Toshio Okuno
Applicant: Etsuji Suzuki , Akira Yonezawa , Toshio Okuno
Main IPC: H05K302
IPC: H05K302

Method of making conductive bump on wiring board

Abstract:

A wiring board structure has an insulating base having at least one projection located thereon, wherein the insulating base and the at least one projection are integrally formed from a same piece of insulating material. The wiring board structure also has at least one lead located on the insulating base, wherein a part of the at least one lead covers the at least one projection to form at least one conductive bump.

Abstract(Chinese):

布线板结构具有绝缘基底，其上具有位于其上的至少一个突起，其中所述绝缘基底和所述至少一个突出部由相同的绝缘材料构成。所述布线板结构还具有位于所述绝缘基底上的至少一个引线，其中所述至少一个引线的一部分覆盖所述至少一个突起以形成至少一个导电凸块。

Public/Granted literature

US20010015012A1 STRUCTURE OF CONDUCTIVE BUMP IN WIRING BOARD Public/Granted day:2001-08-23

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