Invention Grant
- Patent Title: Waveguide optical semiconductor device, method of fabricating the same and optical device module
- Patent Title (中): 波导光半导体器件及其制造方法以及光器件模块
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Application No.: US09434485Application Date: 1999-11-05
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Publication No.: US06360048B1Publication Date: 2002-03-19
- Inventor: Koji Yamada
- Applicant: Koji Yamada
- Priority: JP11-010527 19990119
- Main IPC: G02B610
- IPC: G02B610

Abstract:
A waveguide optical semiconductor device, a method of fabricating the same and an optical device module. The semiconductor device includes a substrate, a waveguide formed on the substrate, an electrode layer formed on the waveguide, and bumpers formed on the substrate. The bumpers are disposed on both side of the waveguide, and top surfaces of the bumpers are higher than a top surface of the electrode layer. The method of fabrication includes forming semiconductor layers for waveguide on a substrate, forming another semiconductor layer on the semiconductor layers, removing the another semiconductor layer and at least a part of the semiconductor layers selectively so that grooves are formed on both side of a region where the waveguide are expected to be formed, removing the another semiconductor layer at the region, remained portions of the another semiconductor layer form bumpers. The module includes a waveguide optical semiconductor device having bumpers disposed on both side of the waveguide, and a carrier having a mounting region in contact with the top surfaces of the bumpers.
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