An apparatus and method for shielding electrical components mounted on a printed circuit board (PCB) from electromagnetic and radio frequency interference by reducing the dissipation of heat away from solder joints. In an embodiment of the invention a radio frequency (RF) shield for a printed circuit board comprises a shield for RF shielding a portion of the PCB having electronic components mounted thereon. The shield has a first portion and a second portion, wherein the first portion has a reduced cross sectional area, for reducing heat conduction between the first and the second portion when the first portion of the shield is inserted into a first plurality of holes in the PCB, for soldering the first portion of the shield to a copper foil of the PCB.