Invention Grant
- Patent Title: Semiconductor device having a plurality of stacked wiring boards
- Patent Title (中): 具有多个层叠电路板的半导体装置
-
Application No.: US09769394Application Date: 2001-01-26
-
Publication No.: US06528870B2Publication Date: 2003-03-04
- Inventor: Kenta Fukatsu , Yasuhito Saito , Masayuki Arakawa , Tomohiro Iguchi , Naotake Watanabe , Yoshitoshi Fukuchi , Tetsuro Komatsu
- Applicant: Kenta Fukatsu , Yasuhito Saito , Masayuki Arakawa , Tomohiro Iguchi , Naotake Watanabe , Yoshitoshi Fukuchi , Tetsuro Komatsu
- Priority: JP2000-020292 20000128; JP2000-160190 20000530
- Main IPC: H01L2302
- IPC: H01L2302
Abstract:
In a stacked-type semiconductor unit having a plurality of semiconductor devices stacked on a base board including a base electrode, each semiconductor device has a wiring board including an external electrode provided in an end portion thereof. The semiconductor devices are stacked on the base board such that the external electrodes are aligned with one another. Then, the external electrodes are electrically connected to the base board by solder.
Public/Granted literature
- US20010028104A1 Semiconductor device, stacked-type semiconductor unit and method for manufacturing the same Public/Granted day:2001-10-11
Information query
