Invention Grant
- Patent Title: Method for making circuit board
- Patent Title (中): 电路板制作方法
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Application No.: US09812345Application Date: 2001-03-20
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Publication No.: US06584682B2Publication Date: 2003-07-01
- Inventor: Robert Edward Belke , Thomas Bernd Krautheim , Vivek Amir Jairazbhoy , Delin Li
- Applicant: Robert Edward Belke , Thomas Bernd Krautheim , Vivek Amir Jairazbhoy , Delin Li
- Main IPC: H05K320
- IPC: H05K320
Abstract:
A method 10 for making multi-layer electronic circuit boards 148, 248 having aperture 146, 246 which may be selectively connected to an electrical ground potential.
Public/Granted literature
- US20020020552A1 Circuit board and a method for making the same Public/Granted day:2002-02-21
Information query
