Invention Grant
- Patent Title: Micromechanical diaphragm
- Patent Title (中): 微机械振膜
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Application No.: US09970608Application Date: 2001-10-03
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Publication No.: US06649989B2Publication Date: 2003-11-18
- Inventor: Hubert Benzel , Frank Schaefer
- Applicant: Hubert Benzel , Frank Schaefer
- Priority: DE10047500 20000926
- Main IPC: H01L2906
- IPC: H01L2906
Abstract:
A micromechanical diaphragm is described which has a partially n-doped p-substrate on its surface and a top n-epitaxial layer, one or more n-epitaxial layers which are p-doped in the diaphragm area being arranged on the p-substrate.
Public/Granted literature
- US20030062579A1 Micromechanical diaphragm Public/Granted day:2003-04-03
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