Invention Grant
- Patent Title: Semiconductor device including a semiconductor pellet having bump electrodes connected to pad electrodes of an interconnect board and method for manufacturing same
- Patent Title (中): 包括具有连接到互连板的焊盘电极的凸起电极的半导体芯片的半导体器件及其制造方法
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Application No.: US09536148Application Date: 2000-03-28
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Publication No.: US06670706B2Publication Date: 2003-12-30
- Inventor: Gorou Ikegami
- Applicant: Gorou Ikegami
- Priority: JP11-151744 19990531
- Main IPC: H01L2940
- IPC: H01L2940
Abstract:
Parts of pad electrodes formed on an interconnection board so as to correspond to bump electrodes of a semiconductor pellet that neighbor parts superposed with the bump electrodes are caused to extend in substantially the same direction, and ultrasonic vibration is applied in this extension direction so as to make a connection between the pad electrodes and the bump electrodes.
Public/Granted literature
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