Invention Grant
- Patent Title: Laminating film and laminate
- Patent Title (中): 层压膜和层压板
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Application No.: US10130264Application Date: 2002-05-24
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Publication No.: US06713166B2Publication Date: 2004-03-30
- Inventor: Takeshi Yamamoto
- Applicant: Takeshi Yamamoto
- Priority: JP2000-295873 20000928
- Main IPC: B32B702
- IPC: B32B702

Abstract:
To provide a laminate film having better shaping processability than conventional laminate films by disposing between the first resin layer 1 and the adhesive layer 3 the second resin layer 2 which has a Vicat softening point lower than that of the first resin layer, has a melting point lower than that of the first resin layer by 2° C. or more, is at least 0.5 times thicker than the first resin layer, and contains as the main component a propylene-&agr;-olefin copolymer. In addition, it becomes possible to provide the laminated structure 5 having the laminate film provided with the second resin layer 2 on the substrate 4. Hence, the present invention has great industrial significance.
Public/Granted literature
- US20020187323A1 Laminating film and laminate Public/Granted day:2002-12-12
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