Invention Grant
- Patent Title: Field emission tips and methods for fabricating the same
- Patent Title (中): 场致发射技术及其制造方法
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Application No.: US10141586Application Date: 2002-05-08
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Publication No.: US06713312B2Publication Date: 2004-03-30
- Inventor: Guy T. Blalock , Sanh D. Tang , Zhaohui Huang
- Applicant: Guy T. Blalock , Sanh D. Tang , Zhaohui Huang
- Main IPC: H01L2100
- IPC: H01L2100

Abstract:
A method for fabricating field emitters from a conductive or semiconductive substrate. A layer of low work function material may be formed on the substrate. Emission tips that include such a low work function material may have improved performance. An etch mask appropriate for forming emission tips is patterned at desired locations over the substrate and any low work function material thereover. An anisotropic etch of at least the substrate is conducted to form vertical columns therefrom. A sacrificial layer may then be formed over the vertical columns. A facet etch of each vertical column forms an emission tip of the desired shape. If a sacrificial layer was formed over the vertical columns prior to formation of emission tips therefrom, the remaining material of the sacrificial layer may be utilized to facilitate the removal of any redeposition materials formed during the facet etch.
Public/Granted literature
- US20020127750A1 Field emission tips and methods for fabricating the same Public/Granted day:2002-09-12
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