Invention Grant
- Patent Title: Uphill screen printing in the manufacturing of microelectronic components
- Patent Title (中): 上光丝印在制造微电子元器件中
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Application No.: US10152257Application Date: 2002-05-21
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Publication No.: US06736058B2Publication Date: 2004-05-18
- Inventor: John M. Michiels , Darryl M. Stansbury
- Applicant: John M. Michiels , Darryl M. Stansbury
- Main IPC: B41M112
- IPC: B41M112

Abstract:
Method for screen printing a continuous structure on a substrate wherein the screen printed structure extends from at least a first level to at least a second level. The disclosed method is particularly suitable for the fabrication of microelectronic devices and components thereof including the fabrication of field emission display devices. Preferably, a print screen of a preferred thickness having a preconfigured print pattern formed therethrough, in combination with a squeegee having a hardness within a preferred range, are used to force a screen printable substance onto a substrate while maintaining a portion of the print screen within a preferred reference angle. The resulting screen printed structure extends from at least one lower level to at least one upper level in a continuous “uphill” manner. The disclosed method is particularly suitable for forming continuous electrically conductive structures or circuit traces extending from a lower level of a substrate, such as an anode plate of an FED device, up onto at least one second surface vertically distanced from the substrate. The electrically conductive structure may optionally terminate into a specifically configured contact pad for accommodating complementary contacting structures located on a mating component, such as a cathode plate of an FED device.
Public/Granted literature
- US20020134259A1 Uphill screen printing in the manufacturing of microelectronic components Public/Granted day:2002-09-26
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