Invention Grant
- Patent Title: Micro-machined electromechanical sensors (MEMS) devices
- Patent Title (中): 微加工机电传感器（MEMS）器件
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Application No.: US10461036Application Date: 2003-06-13
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Publication No.: US06768181B2Publication Date: 2004-07-27
- Inventor: Paul W Dwyer
- Applicant: Paul W Dwyer
- Main IPC: H01L2984
- IPC: H01L2984
Abstract:
Micro-machined electromechanical sensor (MEMS) devices having feature orientation delicately adjusted after initial formation and installation within the device packaging to trim one or more performance parameters of interest, including modulation, bias and other dynamic behaviors of the MEMS devices.
Public/Granted literature
- US20030196489A1 Method of trimming micro-machined electromechanical sensors (MEMS) devices Public/Granted day:2003-10-23
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