Invention Grant
US06768197B2 Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device
有权
硬化助焊剂，抗焊剂，通过硬化助焊剂增强的半导体封装，半导体器件和半导体封装和半导体器件的制造方法
- Patent Title: Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device
- Patent Title (中): 硬化助焊剂，抗焊剂，通过硬化助焊剂增强的半导体封装，半导体器件和半导体封装和半导体器件的制造方法
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Application No.: US10168645Application Date: 2002-06-24
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Publication No.: US06768197B2Publication Date: 2004-07-27
- Inventor: Takeshi Hosomi , Ryouichi Okada , Kensuke Nakamura , Toyosei Takahashi
- Applicant: Takeshi Hosomi , Ryouichi Okada , Kensuke Nakamura , Toyosei Takahashi
- Priority: JP11-371774 19991227; JP2000-019346 20000127
- Main IPC: H01I2348
- IPC: H01I2348
Abstract:
A curable flux which works as a flux during soldering and as a reinforcing material for the soldered portion after being cured by heating; a resist for soldering which coats a circuit pattern having a land for placing solder balls and is cured by heating after the soldering; a semiconductor package and a semiconductor device in which the curable flux is used for soldering and the soldered portion is reinforced with the flux by heating; processes for producing a semiconductor package and a semiconductor device comprising using the curable flux for soldering and curing the curable flux after the soldering to reinforce the soldered portion. The curable flux works as a flux during bonding solder balls to the semiconductor package and soldering the package to a printed circuit board and reinforces the soldered portion after being cured by heating after the soldering.
Public/Granted literature
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