Invention Grant
US06800537B2 Methods of making anisotropic conductive elements for use in microelectronic packaging
有权
制造用于微电子封装的各向异性导电元件的方法
- Patent Title: Methods of making anisotropic conductive elements for use in microelectronic packaging
- Patent Title (中): 制造用于微电子封装的各向异性导电元件的方法
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Application No.: US10342969Application Date: 2003-01-15
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Publication No.: US06800537B2Publication Date: 2004-10-05
- Inventor: Belgacem Haba
- Applicant: Belgacem Haba
- Main IPC: H01L2130
- IPC: H01L2130

Abstract:
A layer of an anisotropic material has a pair of substantially flat oppositely-directed major faces, a vertical direction extending between the faces and horizontal directions transverse to the vertical direction, the layer including a dielectric material and a plurality of conductive particles in the dielectric material. The particles are distributed non-uniformly in the horizontal directions so as to provide areas of high particle concentration interspersed with areas of low particle concentration.
Public/Granted literature
- US20030102154A1 Methods of making anisotropic conductive elements for use in microelectronic packaging Public/Granted day:2003-06-05
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