Invention Grant
US06800537B2 Methods of making anisotropic conductive elements for use in microelectronic packaging 有权
制造用于微电子封装的各向异性导电元件的方法

  • Patent Title: Methods of making anisotropic conductive elements for use in microelectronic packaging
  • Patent Title (中): 制造用于微电子封装的各向异性导电元件的方法
  • Application No.: US10342969
    Application Date: 2003-01-15
  • Publication No.: US06800537B2
    Publication Date: 2004-10-05
  • Inventor: Belgacem Haba
  • Applicant: Belgacem Haba
  • Main IPC: H01L2130
  • IPC: H01L2130
Methods of making anisotropic conductive elements for use in microelectronic packaging
Abstract:
A layer of an anisotropic material has a pair of substantially flat oppositely-directed major faces, a vertical direction extending between the faces and horizontal directions transverse to the vertical direction, the layer including a dielectric material and a plurality of conductive particles in the dielectric material. The particles are distributed non-uniformly in the horizontal directions so as to provide areas of high particle concentration interspersed with areas of low particle concentration.
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