A method of manufacturing a printed wiring board, enabling insertion components to be mounted on both sides thereof, including: a) providing first and second copper-clad laminates, including plated through-holes thereon; b) hot-pressing the laminates with each other and a first prepreg bonding sheet therebetween, so that the through-holes are closed by the prepreg to form non-through holes; c) laminating a second prepreg on each of the surfaces of the composite laminate; d) covering the opening of respective non-through holes with a heat resistant resin film; e) laminating one-side copper-clad laminate on each of the surfaces of the product of (d), with the copper side out, followed by hot-pressing; f) etching the copper sides to form outer layer circuit patterns; g) removing the base material layers covering the openings of the non-through holes; and h) removing the heat resistant resin films of the openings of the non-through holes.