Invention Grant
- Patent Title: Splitter assembly with high density backplane board
- Patent Title (中): 具有高密度背板的分路器组件
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Application No.: US09896809Application Date: 2001-06-29
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Publication No.: US06804353B2Publication Date: 2004-10-12
- Inventor: Paul W. Schmokel
- Applicant: Paul W. Schmokel
- Main IPC: H04M100
- IPC: H04M100

Abstract:
A telecommunications device including a plurality of splitter cards mounted in a chassis, a circuit board, and plurality of card edge connectors for providing electrical connections between the splitter cards and the circuit board, and POTS, LINE, and DATA connectors. The circuit board includes three layers, each layer having tracings that electrically connect at least one POTS, LINE, or DATA connector to at least one of the card edge connector. A center layer includes a grounding plane that is adapted to reduce cross-talk between tracings on a top layer and tracings on a bottom layer. The grounding plane is co-planar with tracings on the center layer such that the grounding plane adds additional thickness to the center layer.
Public/Granted literature
- US20030002656A1 Splitter assembly with high density backplane board Public/Granted day:2003-01-02
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