Invention Grant
- Patent Title: Micromachined device having electrically isolated components and a method for making the same
- Patent Title (中): 具有电隔离部件的微加工装置及其制造方法
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Application No.: US10371899Application Date: 2003-02-20
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Publication No.: US06809392B2Publication Date: 2004-10-26
- Inventor: Mark G. Allen , Charles C. Chung
- Applicant: Mark G. Allen , Charles C. Chung
- Main IPC: H01L31058
- IPC: H01L31058

Abstract:
A micromachined structure having electrically isolated components is formed by thermomigrating a dopant through a substrate to form a doped region within the substrate. The doped region separates two portions of the substrate. The dopant is selected such that the doped region electrically isolates the two portions of the substrate from each other via junction isolation.
Public/Granted literature
- US20030153115A1 Micromachined device having electrically isolated components and a method for making the same Public/Granted day:2003-08-14
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