Invention Grant
- Patent Title: Conductive composition
- Patent Title (中): 导电组成
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Application No.: US10196216Application Date: 2002-07-17
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Publication No.: US06835331B2Publication Date: 2004-12-28
- Inventor: Hironao Fujiki , Motoo Fukushima
- Applicant: Hironao Fujiki , Motoo Fukushima
- Priority: JP2001-216640 20010717
- Main IPC: H01B124
- IPC: H01B124

Abstract:
A conductive composition is obtained by dispersing conductive particles in a curable polymer. At least 50% by weight of the entire conductive particles are those conductive particles coated with a metal on their outermost layer surface and having a specific gravity which differs within ±1.5 from the specific gravity of the curable polymer. The composition remains stable during storage, experiences a minimal change with time of curability, and cures into a conductive rubber which experiences a minimal change with time of volume resistivity.
Public/Granted literature
- US20030107026A1 Conductive composition Public/Granted day:2003-06-12
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