Invention Grant
- Patent Title: Methods of making microelectronic assemblies including compliant interfaces
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Application No.: US10123547Application Date: 2002-04-16
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Publication No.: US06870272B2Publication Date: 2005-03-22
- Inventor: Zlata Kovac , Craig Mitchell , Thomas Distefano , John Smith
- Applicant: Zlata Kovac , Craig Mitchell , Thomas Distefano , John Smith
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg Krumholz & Mentlik, LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/60 ; H01L23/31 ; H01L23/48 ; H01L23/498 ; H05K1/11 ; H05K3/36 ; H05K3/40
Abstract:
An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.
Public/Granted literature
- US20020109213A1 Methods of making microelectronic assemblies including compliant interfaces Public/Granted day:2002-08-15
Information query
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