Invention Grant
- Patent Title: Surface mountable electronic device
- Patent Title (中): 可表面安装的电子设备
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Application No.: US10649005Application Date: 2003-08-26
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Publication No.: US06879040B2Publication Date: 2005-04-12
- Inventor: Kee Yean Ng , Gurbir Singh
- Applicant: Kee Yean Ng , Gurbir Singh
- Applicant Address: US CA Palo Alto
- Assignee: Agilent Technologies, Inc.
- Current Assignee: Agilent Technologies, Inc.
- Current Assignee Address: US CA Palo Alto
- Priority: MYPI20023479 20020918
- Main IPC: H01C1/14
- IPC: H01C1/14 ; H01L23/31 ; H01L23/495 ; H01L23/498 ; H01L33/48 ; H01L33/62 ; H05K3/34 ; H01L23/04 ; H01L23/48 ; H01L23/52
Abstract:
A surface mountable electronic device includes a body with a first surface for mounting the device. The first surface has recessed portions therein. Electrical contacts are provided in the first surface. The electrical contacts include first portions that form at least a portion of at least one inner surface of said recessed portions.
Public/Granted literature
- US20040051171A1 Surface mountable electronic device Public/Granted day:2004-03-18
Information query
