Invention Grant
US06900992B2 Printed circuit board routing and power delivery for high frequency integrated circuits
有权
用于高频集成电路的印刷电路板布线和电源输送
- Patent Title: Printed circuit board routing and power delivery for high frequency integrated circuits
- Patent Title (中): 用于高频集成电路的印刷电路板布线和电源输送
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Application No.: US09955230Application Date: 2001-09-18
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Publication No.: US06900992B2Publication Date: 2005-05-31
- Inventor: Christopher J. Kelly , Jeffrey L. Krieger , Raymond P. Askew
- Applicant: Christopher J. Kelly , Jeffrey L. Krieger , Raymond P. Askew
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/46 ; H05K7/02 ; H05K7/06 ; H05K7/08 ; H05K7/10

Abstract:
A printed circuit board includes a signal layer and a supply voltage plane layer. The signal layer includes traces to communicate signals that are not associated with regulated supply voltages. The supply voltage plane is embedded in the signal layer to supply power to multiple supply voltage pins of a component that is mounted to the printed circuit board. The printed circuit board may also include a supply voltage plane layer to communicate a supply voltage. A ground plane may be embedded in the supply voltage plane layer to provide ground connections to multiple pins of the component.
Public/Granted literature
- US20030053302A1 Printed circuit board routing and power delivery for high frequency integrated circuits Public/Granted day:2003-03-20
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