Invention Grant
- Patent Title: High density microvia substrate with high wireability
- Patent Title (中): 具有高线性的高密度微孔基材
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Application No.: US10701311Application Date: 2003-11-04
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Publication No.: US06919635B2Publication Date: 2005-07-19
- Inventor: Kazushige Kawasaki , Irving Memis
- Applicant: Kazushige Kawasaki , Irving Memis
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent John A. Jordan; William H. Steinberg
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L23/12 ; H01L23/498 ; H05K1/02 ; H05K1/03 ; H05K1/11 ; H05K3/46 ; H01L23/48

Abstract:
The density of plated thru holes in a glass fiber based chip carrier is increased by off-setting holes to positions in which fibers from adjacent holes will not connect. Elongated strip zones or regions having a width approximately the diameter of the holes and running along orthogonal columns and rows of holes, parallel to the direction of fibers, define regions of fibers that can possibly cause shorting between holes. Rotating a conventional X-Y grid pattern of equidistant holes so as to position, for example, alternate holes in one direction between the elongated strip zones running in the opposite direction significantly increases the distance between holes along the elongated strip zones running in each direction. The holes are positioned between elongated strip zones with sufficient clearance to compensate for variations in the linear path of fibers.
Public/Granted literature
- US20050093133A1 HIGH DENSITY MICROVIA SUBSTRATE WITH HIGH WIREABILITY Public/Granted day:2005-05-05
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