Invention Grant
- Patent Title: Wafer metrology apparatus and method
- Patent Title (中): 晶圆计量仪器及方法
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Application No.: US10397917Application Date: 2003-03-26
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Publication No.: US06919958B2Publication Date: 2005-07-19
- Inventor: Fred E. Stanke , Clinton B. Carlisle , Hung Van Pham , Edric Tong , Douglas E. Ruth , James M. Cahill, Jr. , Michael Weber-Grabau , Elliot Burke , Adam E. Norton
- Applicant: Fred E. Stanke , Clinton B. Carlisle , Hung Van Pham , Edric Tong , Douglas E. Ruth , James M. Cahill, Jr. , Michael Weber-Grabau , Elliot Burke , Adam E. Norton
- Applicant Address: US CA Fremont
- Assignee: Therma-Wave, Inc.
- Current Assignee: Therma-Wave, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Stallman & Pollock LLP
- Main IPC: B24B49/12
- IPC: B24B49/12 ; G01B11/06 ; G01B11/30 ; G01N21/21 ; G01N21/95 ; H01L21/66 ; H01L21/67 ; G01N21/88

Abstract:
This invention is an apparatus for imaging metrology, which in particular embodiments may be integrated with a processor station such that a metrology station is apart from but coupled to a process station. The metrology station is provided with a first imaging camera with a first field of view containing the measurement region. Alternate embodiments include a second imaging camera with a second field of view. Preferred embodiments comprise a broadband ultraviolet light source, although other embodiments may have a visible or near infrared light source of broad or narrow optical bandwidth. Embodiments including a broad bandwidth source typically include a spectrograph, or an imaging spectrograph. Particular embodiments may include curved, reflective optics or a measurement region wetted by a liquid. In a typical embodiment, the metrology station and the measurement region are configured to have 4 degrees of freedom of movement relative to each other.
Public/Granted literature
- US20030184742A1 Wafer metrology apparatus and method Public/Granted day:2003-10-02
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