Invention Grant
- Patent Title: Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
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Application No.: US10991707Application Date: 2004-11-18
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Publication No.: US06939737B2Publication Date: 2005-09-06
- Inventor: Ponnusamy Palanisamy
- Applicant: Ponnusamy Palanisamy
- Applicant Address: US NJ Princeton
- Assignee: Sarnoff Corporation
- Current Assignee: Sarnoff Corporation
- Current Assignee Address: US NJ Princeton
- Agent William J. Burke
- Main IPC: G02F1/133
- IPC: G02F1/133 ; G02F1/1333 ; G02F1/1339 ; H01J17/28 ; H01J29/00 ; H01L27/32 ; H01L51/52 ; H05K1/02 ; H05K1/14 ; H05K1/18 ; H05K3/32 ; H05K3/34 ; H05K3/36 ; H05K7/20 ; H01L21/44

Abstract:
An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The electronic device includes a substrate with electronic components coupled to it. The substrate also has a plurality of device electrical contacts coupled to its back surface that are electrically coupled to the electronic components. The flexible circuit board includes a flexible substrate having a front surface and a back surface and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate. The plurality of circuit board electrical contacts correspond to plurality of device electrical contacts. Each Z-interconnection is electrically and mechanically coupled to one device electrical contact and a corresponding circuit board electrical contact.
Public/Granted literature
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