Invention Grant
- Patent Title: Continuous mode solder jet method
- Patent Title (中): 连续模式焊料喷射法
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Application No.: US09944508Application Date: 2001-08-30
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Publication No.: US06960373B2Publication Date: 2005-11-01
- Inventor: Warren M. Farnworth
- Applicant: Warren M. Farnworth
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: B23K3/06
- IPC: B23K3/06 ; B23K20/00 ; B23K35/14 ; B41J2/09 ; H01L21/00 ; H01L21/607 ; H05K3/34 ; H05C1/00 ; B05D1/06

Abstract:
A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.
Public/Granted literature
- US20020031612A1 Continuous mode solder jet apparatus Public/Granted day:2002-03-14
Information query
IPC分类: