Invention Grant
- Patent Title: Three-dimensional nonwoven substrate for circuit board
- Patent Title (中): 电路板三维非织造基板
-
Application No.: US10162027Application Date: 2002-06-04
-
Publication No.: US06964749B2Publication Date: 2005-11-15
- Inventor: Jerry Zucker , Nick Mark Carter
- Applicant: Jerry Zucker , Nick Mark Carter
- Applicant Address: US SC North Charleston
- Assignee: Polymer Group, Inc.
- Current Assignee: Polymer Group, Inc.
- Current Assignee Address: US SC North Charleston
- Agency: Wood, Phillips, Katz, Clark & Mortimer
- Main IPC: C08J5/04
- IPC: C08J5/04 ; B29B15/12 ; B29C70/12 ; B29C70/16 ; B29C70/36 ; B29C70/50 ; B32B5/24 ; D04H1/46 ; D04H1/48 ; D04H3/10 ; D04H5/02 ; D04H13/00 ; H05K1/00 ; H05K1/02 ; H05K1/03 ; H05K3/00 ; H05K3/10 ; B32B27/04
Abstract:
The present invention relates to a nonwoven substrate, and specifically to a nonwoven substrate imparted with a three-dimensional image, wherein the three-dimensional nonwoven substrate is particularly suited as a support substrate for a PCB (Printed Circuit Board) and similar application.By the utilization of a hydroentangled, three-dimensionally imaged support substrate impregnated with a durable resinous matrix, PCB's, and similar applications, can be imparted with unique and useful performance properties, to improve structural performance.
Public/Granted literature
- US20030008590A1 Three-dimensional nonwoven substrate for circuit board Public/Granted day:2003-01-09
Information query
