Invention Grant
- Patent Title: IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC module
- Patent Title (中): IC模块和包括IC模块的无线信息存储介质和无线信息发送/接收装置
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Application No.: US10443789Application Date: 2003-05-23
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Publication No.: US06974909B2Publication Date: 2005-12-13
- Inventor: Junichi Tanaka , Hiroyuki Takubo , Shigenobu Abe
- Applicant: Junichi Tanaka , Hiroyuki Takubo , Shigenobu Abe
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Rader, Fishman & Grauer, PLLC
- Agent Ronald P. Kananen
- Priority: JPP2002-167159 20020607; JPP2002-355108 20021206
- Main IPC: B42D15/10
- IPC: B42D15/10 ; G06K17/00 ; G06K19/07 ; G06K19/077 ; H05K1/02 ; H05K3/20 ; H05K3/32 ; H05K3/34 ; H05K5/06 ; H01L23/28
Abstract:
An IC module includes a lead frame having terminals that are to be connected to an antenna coil of an IC card, and an IC chip and multilayer chip capacitors for tuning mounted on the lead frame and encapsulated by a resin. The multilayer chip capacitors are mounted in grooves on the lead frame.
Public/Granted literature
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