Invention Grant
US06979781B2 Semiconductor package, electronic circuit device, and mounting method of semiconductor device
失效
半导体封装，电子电路器件和半导体器件的安装方法
- Patent Title: Semiconductor package, electronic circuit device, and mounting method of semiconductor device
- Patent Title (中): 半导体封装，电子电路器件和半导体器件的安装方法
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Application No.: US10882204Application Date: 2004-07-02
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Publication No.: US06979781B2Publication Date: 2005-12-27
- Inventor: Kenji Aoki
- Applicant: Kenji Aoki
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2003-191263 20030703
- Main IPC: H01L23/28
- IPC: H01L23/28 ; H01L23/00 ; H01L23/12 ; H01L23/498 ; H05K3/30 ; H05K13/04 ; H05K5/06
Abstract:
A semiconductor package has first and second surfaces and has a plurality of pedestals disposed on the first surface, for keeping a certain height of the semiconductor package after mounting.
Public/Granted literature
- US20050051352A1 Semiconductor package, electronic circuit device, and mounting method of semiconducter device Public/Granted day:2005-03-10
Information query
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