A method for forming EUV LITHOGRAPHY GLASS STRUCTURES WITH VOIDS is disclosed which includes forming a slurry mixture including silica soot particles, and inserting the slurry mixture into a casting mold. The method provides low weight mass reduced rigid glass structures with beneficial thermal stability. The casting mold includes therein a casting form. The casting form is adapted to provide selected geometry void spaces within the glass lithography structure. The slurry mixture is dried to form a green ware object. The casting form is removed from the green ware and the green ware object is consolidated into a lithography glass structure with voids.