Invention Grant
- Patent Title: Cost-reducing and process-simplifying wiring board and manufacturing method thereof
- Patent Title (中): 降低成本和加工简化的布线板及其制造方法
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Application No.: US10859639Application Date: 2004-06-03
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Publication No.: US06998291B2Publication Date: 2006-02-14
- Inventor: Shigetsugu Muramatsu , Tohru Hizume
- Applicant: Shigetsugu Muramatsu , Tohru Hizume
- Applicant Address: JP Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: Ladas & Parry LLP
- Priority: JP2003-187855 20030630
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A wiring board is disclosed that includes a first insulating layer, a conductor which is formed on a surface of the first insulating layer, and a second insulating layer which is formed on surfaces of the first insulating layer and of the conductor. The wiring board is provided with a semispherical-shaped or conical-shaped hole-forming portion which penetrates through the second insulating layer into the conductor.
Public/Granted literature
- US20040266060A1 Cost-reducing and process-simplifying wiring board and manufacturing method thereof Public/Granted day:2004-12-30
Information query
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