Invention Grant
- Patent Title: Adhesive microstructure and method of forming same
- Patent Title (中): 粘合剂微观结构及其形成方法
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Application No.: US10338104Application Date: 2003-01-06
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Publication No.: US07011723B2Publication Date: 2006-03-14
- Inventor: Robert J. Full , Ronald S. Fearing , Thomas W. Kenny , Kellar Autumn
- Applicant: Robert J. Full , Ronald S. Fearing , Thomas W. Kenny , Kellar Autumn
- Applicant Address: US CA Oakland US CA Palo Alto
- Assignee: The Regents of the University of California,The Board of Trustees of the LeLand Stanford Junior University
- Current Assignee: The Regents of the University of California,The Board of Trustees of the LeLand Stanford Junior University
- Current Assignee Address: US CA Oakland US CA Palo Alto
- Agency: Morrison & Foerster LLP
- Main IPC: B32B31/00
- IPC: B32B31/00

Abstract:
A method of forming an adhesive force includes removing a seta from a living specimen, attaching the seta to a substrate, and applying the seta to a surface so as to establish an adhesive force between the substrate and the surface. The seta is applied to the surface with a force perpendicular to the surface. The seta is then pulled with a force parallel to the surface so as to preload the adhesive force of the seta.
Public/Granted literature
- US20040005454A1 Adhesive microstructure and method of forming same Public/Granted day:2004-01-08
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