Invention Grant
- Patent Title: Adhesive to attach a cooling device to a thermal interface
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Application No.: US10007532Application Date: 2001-10-26
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Publication No.: US07025129B2Publication Date: 2006-04-11
- Inventor: Chia-Pin Chiu
- Applicant: Chia-Pin Chiu
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A method of providing thermal connection between a thermal cooling device and an integrated circuit package is provided. An adhesive is applied to a thermal interface outside a heat transfer area thereof. The thermal interface is attached to the cooling device. The device to be cooled is attached to the thermal interface.
Public/Granted literature
- US20030205368A1 Adhesive to attach a cooling device to a thermal interface Public/Granted day:2003-11-06
Information query
