- Patent Title: Fluid-ejection devices and a deposition method for layers thereof
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Application No.: US10620666Application Date: 2003-07-16
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Publication No.: US07025894B2Publication Date: 2006-04-11
- Inventor: Ulrich E. Hess , Samson Berhane , Arjang Fartash
- Applicant: Ulrich E. Hess , Samson Berhane , Arjang Fartash
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B41J2/04
- IPC: B41J2/04
Abstract:
Atomic layer deposition forms a cavitation layer of a print head.
Public/Granted literature
- US20040070649A1 Fluid-ejection devices and a deposition method for layers thereof Public/Granted day:2004-04-15
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