Invention Grant
- Patent Title: Interconnection device and system
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Application No.: US11082364Application Date: 2005-03-17
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Publication No.: US07029289B2Publication Date: 2006-04-18
- Inventor: Che-Yu Li
- Applicant: Che-Yu Li
- Applicant Address: US NY Ithaca
- Assignee: Che-Yu Li & Company LLC
- Current Assignee: Che-Yu Li & Company LLC
- Current Assignee Address: US NY Ithaca
- Agency: Duane Morris LLP
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A connector system including first housing having a first header, the first header including one or more conductive pads that are in electrical communication with a conductor. A second housing that is mateable with the first housing and includes a second header positioned on a mating face. The second header includes one or more conductive pad that are electrically engaged with a conductor and positioned in confronting relation with the one or more conductive pads of the first header. An interposer located between the first header and the second header, with a woven contact that extends continuously through the interposer toward conductive pads on the first and second headers. The interposer is movable between a first position where the woven contact is spaced away from the at least one of the conductive pads, and a second position where woven contact electrically engages one of the conductive pads.
Public/Granted literature
- US20050164534A1 Interconnection device and system Public/Granted day:2005-07-28
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