An energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet has, on at least one side of a base material, an energy-beam-curable viscoelastic layer and a thermo-expandable pressure-sensitive adhesive layer containing thermo-expandable microspheres stacked in this order. The energy-beam-curable viscoelastic layer is, for example, composed of a composition of an organic viscoelastic body and an energy-beam-curable compound or an energy-beam-curable resin. The energy-beam-curable viscoelastic layer has a thickness of about 5 to 300 μm or may be not greater than the maximum particle size of the thermo-expandable microspheres. The energy-beam-curable thermal-releasable pressure-sensitive adhesive layer according to the invention has adhesion enough to withstand a carrying step of an adherend, causes neither winding up of the adhesive nor chipping upon cutting and facilitates peeling and collection of cut pieces after cutting.